An integrated circuit (IC) (100) may be configured to communicate signals to an external device ( e.g., a memory) (120) via a driver (140).The driver may include a plurality of driver circuits arranged in parallel with respect to each other.Each driver circuit in turn may include a plurality of driver sub-circuits.Based, for example, on the load presented by the external device (120) and/or operating conditions of the IC (100), a control circuit (180) may provide signals that enable individual ones of driver circuits to result in a selected driver strength.The control circuit (180) may also provide impedance control signals that enable or disable individual sub-circuits within one or more driver circuit, to thereby control the output impedance of each such driver circuit.
(A) Laid open application for patent or patent of addition
AP:
2012TW-0114256
Inventor
SCOTT GREGORY S VON KAENEL VINCENT R
All applicant/assignee
Apple Inc. ([US]) Apple Inc. ([US])
SCOTT GREGORY S. VON KAENEL VINCENT R.
APPLE INC. ([US])
APPLE INC.
APPLE INC.
Priority Details
2011US-13101862 2011-05-05
Designated States
Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Extension States: BA ME
National States: AE AG AL AM AO AT AU AZ BA BB BG BH BR BW BY BZ CA CH CL CN CO CR CU CZ DE DK DM DO DZ EC EE EG ES FI GB GD GE GH GM GT HN HR HU ID IL IN IS JP KE KG KM KN KP KR KZ LA LC LK LR LS LT LU LY MA MD ME MG MK MN MW MX MY MZ NA NG NI NO NZ OM PE PG PH PL PT QA RO RS RU RW SC SD SE SG SK SL SM ST SV SY TH TJ TM TN TR TT TZ UA UG US UZ VC VN ZA ZM ZW ARIPO: BW GH GM KE LR LS MW MZ NA RW SD SL SZ TZ UG ZM ZW EAPO: AM AZ BY KG KZ MD RU TJ TM EPO: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR OAPI: BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG