Patent Number

CN1097643 C 2003-01-01

Process for making copper foil
The present invention relates to a process for making copper foil from copper-bearing material comprising: (A) contacting said copper-bearing material (10) with an effective amount of at least one aqueous leaching solution (40); (B) contacting a copper-rich aqueous leaching solution (11) with an effective amount of at least one water-insoluble extractant (20); (C) separating a copper-rich extractant (48) from a copper-depleted aqueous leaching solution (14); (D) contacting said copper-rich extractant (48) with an effective amount of at least one stripping solution (22); (E) separating a copper-rich stripping solution (16) from a copper-depleted extractant (64); (F) flowing said copper-rich stripping solution (25) between an anode (28) and a rotating cathode (26), and applying an effective amount of voltage across said anode and said cathode to deposit copper (26a) on said cathode; and (G) continuously removing copper foil (12) from said cathode.		©Questel

FamPat family

Publication Number		Type	Publi.Date	Links
	EP0786021	A1	1997-07-30
	STG:	(A1) Application published with search report
	AP:	1994EP-0910961
	EP0786021	A4	1997-07-30
	STG:	(A4) Supplementary search report
	AP:	1994EP-0910961
	EP0786021	B1	2000-01-12
	STG:	(B1) Patent specification
	AP:	1994EP-0910961
	US5366612	A	1994-11-22
	STG:	(A) Patents Granted before 2001-04-15
	AP:	1993US-08049176
PCT	WO94/24338	A1	1994-10-27
	STG:	(A1) Published application with search report
	AP:	1994WO-US02869
	DE69422646	D1	2000-02-17
	STG:	(D1) Grant (no unexamined application published) patent law 81
	AP:	1994DE-6022646
	DE69422646	T2	2000-05-31
	STG:	(T2) Trans. of EP patent
	AP:	1994DE-6022646
	JPH08-509028	A	1996-09-24
	STG:	(A) Published application
	AP:	1994JP-0523186
	JP3134937	B2	2001-02-13
	STG:	(B2) Published granted patent (Second level) from 01-03-1996 onwards (Published examined patent application (Second level) 1971-1996)
	AP:	1994JP-0523186
	RU2123543	C1	1998-12-20
	STG:	(C1) Patent for invention
	AP:	1995RU-0120203
	BR9405987	A	1995-12-19
	STG:	(A) Published application
	AP:	1994BR-0005987
	CA2155209	A1	1994-10-27
	STG:	(A1) Application laid open
	AP:	1994CA-2155209
	CA2155209	C	2000-06-06
	STG:	(C) Patent (second level)
	AP:	1994CA-2155209
	AU6366694	A	1994-11-08
	STG:	(A) Open to public inspection
	AP:	1994AU-0063666
	AU679974	B2	1997-07-17
	STG:	(B2) Patent preceeded by A1
	AP:	1994AU-0063666
	CN1121361	A	1996-04-24
	STG:	(A) Published application
	AP:	1994CN-0191818
	CN1097643	C	2003-01-01
	STG:	(C) Granted patent for invention
	AP:	1994CN-0191818
	TW335416	B	1998-07-01
	STG:	(B) Granted patent or patent of addition
	AP:	1994TW-0109171

First Date of Grant

2000-01-12

1994-11-22

2000-02-17

2001-02-13

1998-12-20

1997-07-17

1998-07-01

2000-06-06

2003-01-01

Inventor

CLOUSER SIDNEY J
EAMON MICHAEL A
JORDAN THOMAS L
KOHUT STEPHEN J

All applicant/assignee

ElectroCopper Products Limited ([US])
ElectroCopper Products Limited ([US])
ElectroCopper Products Limited ([US])

Magma Copper Company ([US])
Gould Electronics Inc. ([US])

MAGMA COPPER COMPANY ([US])
GOULD ELECTRONICS INC. ([US])

ELECTROCOPPER PRODUCTS LTD., CHANDLER
ELECTROCOPPER PRODUCTS LTD., CHANDLER

EhlektroKupper Prodakts Limited

MAGMA COPPER COMPANY
GOULD ELECTRONINS INC.
ELECTROCOPPER PRODUCTS LIMITED

ELECTROCOPPER PRODUCTS LIMITED

MAGMA COPPER COMPANY
GOULD ELECTRONICS INC.

Magma Copper Company ([US])
Gould Electronics Inc.
GA-TEK Corp. ([US])

Priority Details

1993US-08049176 1993-04-191994WO-US02869 1994-03-17

Designated States

Contracting States: DE FR GB IT

National States: AT AU BB BG BR BY CA CH CN CZ DE DK ES FI GB HU JP KP KR KZ LK LU LV MG MN MW NL NO NZ PL RO RU SD SE SK UA UZ VN
EPO: AT BE CH DE DK ES FR GB GR IE IT LU MC NL PT SE
OAPI: BF BJ CF CG CI CM GA GN ML MR NE SN TD TG

�Questel